找诗词>英语词典>dicing翻译和用法

dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

  • 骰子;色子
    Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
    1. 掷骰子游戏
      Diceis a game which is played using dice.
      1. VERB 把(食物)切成小块;将…切丁
        If youdicefood, you cut it into small cubes.
        1. Dice the onion...
          把洋葱切成丁。
        2. Add the crushed garlic and remaining diced vegetables.
          加入捣碎的大蒜和剩余的蔬菜丁。

      双语例句

      • The system functions mainly include macro dicing, micro planning and district demolition.
        该系统主要有学校宏观划片、微观规划和片区拆迁等功能。
      • Experimental Research on Improving Properties of Composite Electroplated Diamond Dicing Blade
        提高复合电沉积金刚石切割片性能的试验研究
      • Freddy Krueger plays the vengeful monster who kills by slicing, dicing and chopping people who had murdered him.
        弗雷迪·克鲁格扮演一个复仇的魔鬼,他把那些杀害他的人一一肢解至死。
      • A lady doesn't crawl around on the decks dicing with the crew.
        高贵女士可不会和船员们在船的甲板上来回爬。
      • In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
        本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
      • We are dicing for drinks.
        我们在掷骰子赌喝酒。
      • Introduces the development of semiconductor industry, the characteristic of laser wafer dicing technology, the structure of laser wafer dicing machine, and the application in the production.
        介绍了半导体行业的发展,晶圆激光划片技术的特点、激光划片系统的组成与其在实际过程中应用。
      • Performance analysis and three-dimensional modeling of wafer dicing with diamond blade
        金刚石砂轮刀片划切过程性能分析与三维建模
      • Upon the installation of a multi beam laser dicing system, the obviously advantages of using such a laser dicing process become evident.
        基于已经安装的多光束激光划片系统,其显著的优点已经得到证实。
      • Study on Mechanism and Driving Error of θ Axis for the Abrasive Dicing Saw
        砂轮划片机θ向机构和传动误差分析