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fabs

网络  绝对值; 生物利用度; 会计准则委员会; 求浮点数的绝对值; 浮点数的绝对值

化学

双语例句

  • In addition, a lack of cutting-edge technology has forced many new entrants into contract manufacturing, a segment that requires increasingly huge investments in ever more expensive fabs.
    此外,尖端技术的匮乏,迫使许多新入行者进入了代工行业这个行业要求向越来越昂贵的晶圆厂投入越来越庞大的资金量。
  • Toshiba did not say how many its wafer fabs have been directly affected by events on Friday or are now being closed due to the power saving decision.
    东芝并没有公布其属下的芯片厂在上周五的地震中有哪几间受到了直接的影响,也没有公布哪几间芯片厂会受到这次断电行动的影响。
  • SMIC tried to use this competition to its benefit, working out deals in the cities of Chengdu, Wuhan and Shenzhen under which the local governments paid for part or all of the cost of the fabs, which SMIC agreed to run.
    中芯国际试图从这种竞争中获利。公司与成都、武汉以及深圳市都签订了协议。根据协议,地方政府支付加工厂的部分或全部建设费用,中芯国际负责对工厂进行运营管理。
  • Research on Rescheduling for Semiconductor Wafer FAbs Manufacturing
    半导体制造重调度研究
  • Methods: ( 1) human anti-HBsAg, TNF-α and keratin Fabs were expressed under the control of Ara promoter or Lac promoter, and their background expression levels were compared.
    方法:(1)以Ara启动子和Lac启动子驱动抗HBS、TNF-α及角蛋白的人Fab段,比较其本底表达。
  • DRAM prices and margins skyrocketed, and companies raced to build new fabs, some of which were ready for action just in time for the inevitable market downturn in1997-98.
    内存的价格和利润都在以火箭速度上升,各大公司争先恐后地建设新的内存芯片生产厂。
  • Furthermore, the capital investment is limited for new entrants since existing IC fabs may be utilized for the key components.
    而且,主要投资有限,因为关键部件可以利用现有的IC工厂生产。
  • With Mr Wang at the helm, SMIC has moved to streamline capacity, changing how it runs two fabs in central China owned by local governments there.
    王宁国上任后,中芯国际开始精简产能,改变华中地区地方政府所有的两家晶圆厂的经营方式。
  • Investors and semiconductor companies are wondering what future applications and product needs will keep the fabs well utilized.
    投资者和半导体公司想要知道将来什么产品可以使生产厂保持利润。
  • To simplify transportation and minimize the risk of contamination, fabs make use of "front-opening unified pods," or FOUPs.
    为了简化运输和尽可能降低被污染的风险,芯片制造商利用“前开式标准晶圆盒”即所谓的FOUP来搬运晶圆。